A case study about how a light-curable adhesive replaced a two-part epoxy for faster sensor assembly and improved the application process. ...
电气防爆和传感器技术
A world leader in electrical explosion protection and sensor technology was looking to turn away from laser welding for an application that requires sealing two polycarbonates of their photoelectric sensors.
Challenge
Finding an alternative solution to laser welding for bonding a PC PCBA holder to a PC clear cover in a photoelectric sensor.
The customer was bonding PC covers to PC PCBAs by laser welding. However, they were unsatisfied with the results, as laser welding between PC and PC gives inconsistent bond results and lower units per hour (UPH). It also requires large laser weld equipment that takes up a lot of floor space. Our Dymax Application Engineers recommended using light-curing adhesives to replace the current laser weld process.
Solution
Dymax 3094-GEL-REV-A provided the best bonding results by providing IP67 ingress protection and meeting reliability requirements.
To support the customer in finding the most suitable light-curing adhesives and curing equipment for the process, the AE team tested several materials with customer parts in our laboratories and found that 3094-GEL-REV-A provided the best bonding strength when being cured with a 5000-EC flood curing system. This curing system offers high-intensity curing energy over a 5x5 inch area and 5-30 second cure times (typically) when using Dymax light-curable materials. Dymax application engineers optimized the process and provided the solutions to the customer, who was pleased with the test results and decided to put 3094-GEL-REV-A into their production qualification process.
结果
The customer improved their process by achieving better bonding and higher UPH.
The parts built with 3094-GEL-REV-A passed the customer’s reliability requirement for IP67 ingress protection, thermal cycling at -40°C to 70°C, and damp-heat soaking at 70°C/90%RH. The customer was satisfied with the results and proceeded to qualify the low-stress active bonder 3094-GEL-REV-A to replace the laser welding process. Dymax solutions system provided them with faster UPH and reduced the production floor space.
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