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Rapid curing maximizes production speed.

Rapid curing maximizes material usage and results in increased throughput and production capacity.

Curing speed enables faster processing and reduces cost.

Dymax Corporation offers Ultra Light-Weld^® 9008, a light-curable encapsulant engineered to rapidly encapsulate and seal electronic components in chip-on-flex or chip-on-board applications.

Dymax Multi-Cure^® 9-20557 cures in seconds upon exposure to UV/Visible light and is designed for rapid conformal coating of printed circuit boards and other electronic assemblies.  

SpeedMask^® 730-BT is a masking resin formulated to provide excellent surface protection during chemical milling/etching, plating, anodizing, and aggressive grit-blasting operations aiding in the manufacturing, overhaul, repair, and rework of turbine engine blades, vanes, and other turbine components as well as many other metal finishing applications.

The Dymax MD^® "1200" series adhesives are ideal for rapid bonding of a wide variety of substrates found in reservoirs, plastic housings, respiratory devices, needles, syringes, tube sets, fittings, and other medical devices.  

Dymax is proud to introduce the BlueWave® MX-275 high-intensity flood-curing system.

Senior R&D Manager of the adhesives team at Dymax, Dr. Aysegul Kascatan Nebioglu, was a presenter at the IPC/ APEX Expo 2019 which took place on January 26 to 31 in San Diego, California.